Welcome to Bilz Vibration Technology AG
Precision levelling wedges Series PKA-VA
Easily adjustable levelling wedge in stainless steel for precise leveling during machine installation, especially under heavy loads, can be bolted to the machine bed.
Description series PKA-VA
- Bilz precision levelling wedge PKA-VA (bolt-on) in stainless steel version 1.4301.
- The levelling wedge is very easy to adjust.
- The bolt-on levelling wedges remain in position even when the machine is lifted, signifi cantly easing the installation of the machine.
Note
- The specified maximum load is composed of static and dynamic loading of the machine.
- All sizes also available with stainless steel spherical seat (PKAK-VA).
- Vibration Isolation is possible by adding Bilz insolation pads (also in EPDM or VITON)
- Permissible temperature range: -20 °C bis +80 °C
- General tolerances in accordance with ISO 2768 mK
Learn More →
Width across flats
| Type | outer |
|---|---|
| PKA 1-VA | WAF 19 |
| PKA 2-VA | WAF 22 |
PKA-AL variants
| Type | item-no. | max. load N/pc. | L mm | B mm | H centre position mm | d mm | e mm | Internal thread | Adjustment range mm |
|---|---|---|---|---|---|---|---|---|---|
| PKA 1-VA | 15-0001 | 20.000 | 115 | 115 | 44 | 50 | 24 | M16 | +3/-3 |
| PKA 2-VA | 15-0020 | 40.000 | 150 | 150 | 47 | 60 | 24 | M18 | +3/-5 |
PKA-VA fixing bolts
- Suitable screws and nuts with standard thread can be supplied on request. Delivery includes 1 nut and 1 washer each.
Learn More →
Item numbers PKD bolts and nuts
| Thread | Material | Length mm 100 | Length mm 125 |
|---|---|---|---|
| M16 | stainless steel | 18-0083 | 18-0080 |
| M18 | stainless steel | 18-0084 | – |
Semiconductor
BILZ MACHINE FEET IN SUCCESSFUL USE FOR 15 YEARS
Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
Learn More →
Customer
Key Facts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
Learn More →
Looking for the right product?
Learn More →
Width across flats
| Type | outer |
|---|---|
| PKA 1-VA | WAF 19 |
| PKA 2-VA | WAF 22 |
