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Mechanical pneumatic level control MPN-LCV
Reset accuracy is ± 1/10 mm
Description
Mechanical pneumatic level control MPN-LCV
- Extremely robust galvanised proportional valve to prevent tilting as a result of load changes. The level is continuously sensed by means of a plunger. The position of the plunger is directly applied to the valve and the air spring is pressurised or vented respectively. The target level is adjusted by turning the knurled adjustment ring and is maintained with an accuracy of ± 1/10 mm. Three control valves are used, which can be connected to an additionally available maintenance unit for compressed air preparation. This limits the system pressure to max. 6 bar, removes any condensate and cleans the compressed air of solid particles (rust and dust).
Note
- Galvanised proportional valve
- The reset accuracy is ± 1/10 mm
- The air flow can be reduced using the throttle valve should the control system tend to overshoot
- Compressed air quality must be in accordance with ISO 8573-1:2010 in order to operate the air elements: Air class 3.4.3
- Supplied as a complete set which includes the 3 control valves and all necessary hose lines and connectors for 4 air springs. All components are also available individually as spare parts.
- TIn addition to the standard solutions listed here we also hold special versions with regard to material, flow, accuracy and restoring force
Air maintenance unit with pressure regulator and filter
- The air maintenance unit is used to set the optimum system pressure and prepare the compressed air for the air spring system. The integrated compressed air preparation system traps incidental condensate and cleans the compressed air of particles such as rust and dust. This ensures the required compressed air quality (air class 3.4.3) according to ISO 8573-1:2010. WFD-M:
Item mo. 61-0140
Version with additional filter (up to 5 µm)
Anti-trapping protection
The anti-trapping protection can be used to reduce the risk of crushing in the area of the valve or sensor plungers. The anti-trapping protection can be attached to the special carbide washer supplied and consequently can also be retrofitted to existing systems. It can be removed without damage for maintenance work.
Anti-trapping protection incl. compatible hard metal disc, per valve:Item no. 50-0276
Bellows
To protect the LCV valve in contaminated environments.
Per valve:item no. 66-0001
Semiconductor
Precision and impulse decoupling for link trimming
Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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