Welcome to Bilz Vibration Technology AG
AIS™ Active Isolation System
Active electronic-pneumatic vibration isolation with 3 or 6 degrees of freedom.
General
With the AIS™ Active Isolation System, active control significantly improves vibration isolation by suppressing amplification at resonance without degrading properties at higher frequencies. In this process, the AIS™ maintains its active properties over the entire working travel (stroke) of the air spring. In dynamic applications, the active response of the system ensures reduced deflection times after excitation. The system is consequently quicker at rest and in measuring tasks with positioning movements achieves shorter cycle times than passive systems. The special feature of the system is the pneumatic actuator principle, which covers a wide dynamic working range – even in the case of very heavy machines. Control bandwidths up to the 300 Hz range are possible due to extremely fast-reacting valves. The system reacts in real time and consequently so quickly that feed-forward signal control can be dispensed with. The AIS™ can be used with three or six actively controlled degrees of freedom (DOF). The system can be adapted to the different application requirements. Three vertically aligned controllers are used with three regulated degrees of freedom, which actively regulate the vertical position and the rotations around both horizontal axes. The other degrees of freedom are passively reset by the membranes. With the use of 6 controlled degrees of freedom, the HAB horizontal air springs are also used. In this configuration, six controllers are arranged both vertically and horizontally.
AIS™ High Performance
Additional BiAir air springs rotated by 90° are used in the AIS™ High Performance version to generate higher horizontal counter forces. The horizontal HAB air springs act purely as air bearings. This eliminates even minor friction effects and influences of the membrane.
| Technical data | AIS™ 3 degrees of freedom | AIS™ 6 degrees of freedom | AIS™ High Performance 6 degrees of freedom |
|---|---|---|---|
| Typical system load* | 800 kg – 120.000 kg | 800 kg – 120.000 kg | 800 kg – 120.000 kg |
| Vertical natural frequencies* | 1,2 – 2,5 Hz | 1,2 – 2,5 Hz | 1,2 – 2,5 Hz |
| Horizontal natural frequencies* | 2,2 – 2,8 Hz | 1,1 – 1,9 Hz | 0,8 – 1,9 Hz |
| Type of control | Servo-pneumatic | Servo-pneumatic | Servo-pneumatic |
| Actively controlled frequency range | 0-15 Hz | 0-15 Hz | 0-15 Hz |
| Clean room suitable | yes | yes | yes |
| Communication interfaces | Ethernet, Digital I/O, RS232 | Ethernet, Digital I/O, RS232 | Ethernet, Digital I/O, RS232 |
SENSOR RESOLUTION:
| Sensor resolution | AIS™ 3 degrees of freedom | AIS™ 6 degrees of freedom | AIS™ High Performance 6 degrees of freedom |
|---|---|---|---|
| Displacement measuring system | 0,2 µm | 0,2 µm | 0,2 µm |
| Acceleration sensor | 8 µg | 8 µg | 8 µg |
| Pressure sensor | 0,2 mbar | 0,2 mbar | 0,2 mbar |
| Sampling rate sensor signals | 4 kHz (after oversampling) | 4 kHz (after oversampling) | 4 kHz (after oversampling) |
| Note | *Customised modifications possible |
System structure (simplified)
AIS™ High Performance
Additional BiAir air springs rotated by 90° are used in the AIS™ High Performance version to generate higher horizontal counter forces. The horizontal HAB air springs act purely as air bearings. This eliminates even minor friction effects and influences of the membrane.
Semiconductor
Precision and impulse decoupling for link trimming
Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
Automotive
More than 75% isolation efficiency
AVL: Trouble-free operation of engine test benches
Learn More →
Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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