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Precision levelling wedges Series PKAK-AL
Easily adjustable levelling wedge with excellent wear properties, particularly suitable for EMC and clean room applications. Can be bolted to the machine bed and used to compensate for angle differences.
Description series PKAK-AL
- Bilz precision levelling wedges in new aluminium version with hard anodising (hardcoat) and stainless steel spherical seat are notable for their high layer density, hardness – up to 600 HV, and excellent wear protection properties.
- The levelling wedge is very easy to adjust and particularly suitable for EMC applications. Applications: Machines for the food and luxury food industry, machines for the packaging, chemical and pharmaceutical industries. For applications in clean rooms, we provide special solutions without lubricants and for higher loads. We are also able to develop a wide range of special solutions. We are always happy to offer our advice.
Note
- The specified maximum load is composed of static and dynamic loading of the machine.
- Mounting with Bilz insulation pads is also possible (see drawing; also in EPDM or clean room applications).
- General tolerances in accordance with ISO 2768 mK. Permissible temperature range: -20 °C to +80 °C
- Natural colour dark grey
- Please contact us if the size, insulation pad mounting or bold size that you are looking for is not listed. In addition to our standard solutions and colours we also carry numerous special solutions. We are always happy to give advice.
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Width across flats
| Type | outer |
|---|---|
| PKA 1-AL | WAF 19 |
| PKA 2-AL | WAF 22 |
| PKA 3-AL | WAF 27 |
| PKA 4-AL | WAF 27 |
PKA-AL variants
| Type | item no. | max. load N/pc. | L mm | B mm | H center position mm | Ø D mm | d mm | e mm | Internal thread | Adjustment range mm |
|---|---|---|---|---|---|---|---|---|---|---|
| PKAK 1-AL | 05-0018 | 19.000 | 115 | 115 | 54 | 110 | 50 | 24 | M16 | +3/-3 |
| PKAK 2-AL | 05-0019 | 32.000 | 150 | 150 | 63 | 150 | 60 | 24 | M18 | +3/-5 |
| PKAK 3-AL | 05-0020 | 57.000 | 200 | 200 | 69 | 150 | 80 | 27 | M20 | +4/-5 |
| PKAK 4-AL | 05-0021 | 72.000 | 200 | 250 | 89 | 150 | 95 | 27 | M20 | +9/-5 |
Fixing bolts
- Suitable screws and nuts with standard thread can be supplied on request. Delivery includes 1 nut and 1 washer each..
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Item numbers PKAK-AL bolts and nuts
| Thread | Material | Length 100mm | Length 125mm | Length 150mm |
|---|---|---|---|---|
| M16 | stainless steel | 18-0083 | 18-0080 | – |
| M18 | stainless steel | 18-0084 | – | – |
| M20 | stainless steel | 18-0085 | – | 18-0081 |
Semiconductor
BILZ MACHINE FEET IN SUCCESSFUL USE FOR 15 YEARS
Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
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Customer
Key Facts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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Width across flats
| Type | outer |
|---|---|
| PKA 1-AL | WAF 19 |
| PKA 2-AL | WAF 22 |
| PKA 3-AL | WAF 27 |
| PKA 4-AL | WAF 27 |
