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Electronic Pneumatic Level Control EPN
Electronic pneumatic level control system for use with dynamic and vibration sensitive measuring machines as well as testing and production machines.
Description
Electronic pneumatic level control systems are suitable for combination with BiAir® membrane air springs. By using an intelligent control algorithm and electronic valves with flow rates of up to 250 l/min, deflections and settling times can be significantly reduced compared to mechanical-pneumatic level controls. The Bilz electronic pneumatic level control systems are ideally suited for use with dynamic and vibration sensitive measuring machines as well as testing and production machines.
Note
The EPN is designed as an integrated central control system including the proportional valves to minimise the space required on machine side and the reduce installation effort. Only the hoses to the air springs, as well as the cables to the displacement transducers, are to be attached directly to the machine. Three control circuits can be monitored and controlled independently of each other using a PID controller. Height sensing takes place per control circuit and is processed with 16 bits. A potentiometer or non-contact sensor is available as standard. The system also has pressure monitoring for each control circuit and the air supply. The parameters can be set via a web interface for easy commissioning. Communication with a higher-level control system can take place via digital inputs/outputs as well as via a separate bus interface. The EPN is optimized for the cost-efficient implementation of electro-pneumatic level control on machines.
| Technical data | Value |
|---|---|
| Reset speed | fast |
| Regular rest | very good |
| Damping | 15 % passive out of air spring |
| Valve type | poppet valve (proportional) |
| Application BiAir | yes |
| Application FAEBI | yes |
Comparison of sensor variants
| Feature | Contact sensor | Non-contact sensor |
|---|---|---|
| Machine contact | Yes | No |
| Wear | Yes | No |
| Height adjustability | No | Yes |
| Measuring range | 12 mm or 24 mm | 13 mm |
| Reset accuracy | < ± 0,01 mm or < ± 0,02 mm | < ± 0,01 mm |
System structure (simplified)
Sensor variants
- Successor of the proven EPN control system (retrofit)
- Control of 3 degrees of freedom per control unit
- Height detection via potentiometer or non-contact sensor
- Position accuracy < ± 0.01 mm
- Control of air springs via proportional valves
- Compatible with BiAir® membrane air springs
- Compatible with FAEBI® rubber air springs with additional filter
- Adjustable system parameters via PID controller
- Low deflections and settling times during load changes
- Intelligent browser-based interface
- Visualization (WebVisu) for adjustment and diagnostics
- Remote maintenance possible
- Industry 4.0 interface can be implemented
- Shutdown to safe state even in case of power failure or pressure loss
Semiconductor
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Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
Automotive
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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