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Electronic Pneumatic Position Control EPPC™
Real-time level control for highly dynamic and vibration sensitive machines and instruments.
Description
Mechanical pneumatic level control MPN-PVM
- The Electronic Pneumatic Position Control EPPC™ provides optimum vibration isolation for high-precision machines, highly dynamic and vibration-sensitive measuring machines, microscopes and testing and production machines. The EPPC™ can be combined with three to six BiAir® membrane air spring control groups to control up to six degrees of freedom. Bilz offer a wide range of different size air springs for system design.
Note
The high-performance electronics, comprising a 14-bit AD converter and 16-bit signal processor, are integrated into the pressure control valves and so ensure virtually noise-free control. Losses (pressure drops) within the hose connections are minimised by directly connecting the pressure control valves to the respective air springs. The use of CAN bus technology means that the control unit can be installed up to 20 m away. The EPPC™ is consequently suitable for use in sensitive environments such as clean rooms or laboratories.
Notes on the graphic
Theoretical vibration curve of a mechanical-pneumatic level control system (MPN) compared to the EPPC™. At a deflection of -80 μm, the MPN reaches a stable position within +/-15 μm after approx. 0.75 seconds. With the EPPC™, the deflection time is reduced by approx. 45 % to 0.4 seconds.
| Technical data | Value |
|---|---|
| Typical system load* | 800 kg – 120.000 kg |
| Vertical natural frequencies* | 1,2 – 2,5 Hz |
| Horizontal natural frequencies* | 2,2 – 2,8 Hz |
| Type of control | Servo-pneumatic |
| Clean room suitable | yes |
| Communication interfaces | Ethernet, Digital I/O |
| SENSOR RESOLUTION: | |
| Displacement measuring system | 0,76 µm |
| Pressure sensor | 0,36 mbar |
| Sampling rate sensor signals | 1 kHz (after oversampling) |
| Note | *Customised modifications possible |
*Customised modifications possible
System structure (simplified)
Properties
- Optimum positional accuracy (+/-10 µm)
- Individually adjustable system parameters (such as damping)
- Short deflection and settling times in response to load changes
- One high-performance servo valve and one displacement sensor per degree of freedom
- Optimised connecting system using CAN bus technology
- Intelligent browser-based user interface for setting, diagnostics and monitoring, connection via Ethernet, remote maintenance possible
- Operator status display (e.g. ready, working position, motion complete, error)
- Digital I/O interfaces for external control and monitoring
- Noise-free control due to high-resolution signal processing and servo-valve technology
- Robust and proven air spring technology, can be combined with Bilz BiAir® membrane air springs
- No disturbing heat generation, magnetic field fluctuations or high power consumption as in electromagnetic actuators
Semiconductor
Precision and impulse decoupling for link trimming
Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
Learn More →
Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
Automotive
More than 75% isolation efficiency
AVL: Trouble-free operation of engine test benches
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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