*unpainted, aluminium
Welcome to Bilz Vibration Technology AG
Membrane air spring isolator Series BiAir®-ED-HE
Very low-frequency (vertical 1.7 Hz) membrane air spring with precisely adjustable degree of damping for effective vibration isolation. Made of cast aluminium, universally applicable.
Description
Series BiAir®-ED-HE in cast aluminium
- The BiAir® membrane air spring insulator is made of cast aluminium. The air space is enclosed by a thin-walled flexible and pressure-resistant rolling membrane. The piston sits on the membrane and is pressed into place by the air volume. This design allows for highly effective vibration isolation. In order to simultaneously achieve the greatest possible damping effect, the interior of the air spring is divided intotwo air chambers connected by an air hose (load and damping volume). An adjustable throttle valve is used to set the flow cross section to the desired damping effect from the outside. The friction in the air flow generated by the throttle valve can create a damping effect of up to 15 %. Damage to the rolling membrane due to overpressure is virtually impossible through the use of additional safety valves or a mechanical piston stroke limit.
General information regarding selection and application of our BiAir® ED-HE membrane air springs
- The maximum permissible movement amplitude in the horizontal plane is between approximately 1 to 2 mm depending on the size of the air spring.
- Please select the load at an air pressure of 4 bar when selecting the air spring size.
- Permissible temperature range: -20 °C to +80 °C
- In addition to the standard solutions listed here we also offer numerous air springs with a larger stroke and lower natural frequency.
- Powder-coated in RAL similar to 7037 dusty grey
- The powder coated air springs are also available in other RAL colours on request
Variant selection BiAir®-ED-HE in cast aluminium
| Type | Item no. | Natural frequency vertical / horizontal Hz | Ø A mm | B mm | Ø C mm | Working height H BiAir-ED-HE mm | +/- Travel mm | max. load N at an air pressure of 4 bar | max. load N at an air pressure of 6 bar |
|---|---|---|---|---|---|---|---|---|---|
| 0,5* | 50-0145 | 1,7/2,8 | 120 | 216 | 129 | 307 | +/- 2,5 | 2.670 | 4.000 |
| 1 | 50-0027 | 1,7/2,8 | 172 | 288 | 200 | 307 | +/- 2,5 | 6.330 | 9.500 |
| 1,5 | 50-0021 | 1,7/2,8 | 212 | 305 | 230 | 307 | +/- 3,5 | 10.170 | 15.260 |
| 2 | 50-0046 | 1,7/2,8 | 226 | 335 | 260 | 307 | +/- 2,5 | 14.200 | 21.300 |
| 2,5 | 50-0037 | 1,7/2,8 | 271 | 378 | 300 | 307 | +/- 3,0 | 19.670 | 29.500 |
| 3 | 50-0056 | 1,7/2,8 | 348 | 467 | 382 | 307 | +/- 2,5 | 34.130 | 51.200 |
| 4 | 50-0065 | 1,7/2,8 | 490 | 605 | 530 | 307 | +/- 2,75 | 65.730 | 98.600 |
Mechanical pneumatic level control MPN-LCV
- The mechanical pneumatic level control MPN-LCV with our robust LCV proportional valves is a simple but effective solution to prevent tilting as a result of load changes. The target level is adjusted by turning the knurled adjustment ring and is maintained with an accuracy of ± 1/10 mm.
Item no. 61-0012
Mechanical pneumatic level control MPN-PVM
The mechanical pneumatic level control MPN-PVM with our robust PVM proportional valves is a simple but effective solution to prevent tilting as a result of load changes. The target level is adjusted by turning the knurled adjustment ring and is maintained with an accuracy of ± 1/100 mm.
Item no. 61-0010
Electronic Pneumatic Position Control EPPC™
EPPC™ – Real-time level control for efficient vibration insulation of vibration sensitive, highly dynamic machines and strict requirements on positional accuracy and setting time
Semiconductor
Precision and impulse decoupling for link trimming
Eitzenberger GmbH: Dynamic Wafer Stage EZ-GS0760
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Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
Automotive
More than 75% isolation efficiency
AVL: Trouble-free operation of engine test benches
Learn More →
Customer
Keyfacts
- High-performance vibration isolation
Background
Eitzenberger GmbH, based in Wessobrunn in the Munich metropolitan region, develops high-precision solutions for air bearings and air bearing systems for a wide range of industrial applications, including the semiconductor industry. Their solutions are characterized by extreme accuracy, high dynamics, and a compact design, while also being suitable for cleanroom environments. With the Dynamic Wafer Stage EZ-GS0760, Eitzenberger has implemented a globally unique positioning system featuring dual impulse decoupling in the X and Y axes.
Task
The Dynamic Wafer Stage is used in a laser micromachining system. The system can process both 200 mm and 300 mm wafers and impresses with high throughput and precise process control. During link trimming, microscopically fine conductor paths (fuses) on memory chips, sensors, or micro-LEDs are selectively cut by laser radiation. This enables the activation, programming, or deactivation of specific circuits to ensure the functionality of the chip in case defects are detected during the test cycle. The application requires extremely precise three-dimensional positioning and stable laser focusing — with structure sizes of only 1–2 µm, a required positioning accuracy of < 100 nm, and repeatability of < 40 nm.
Bilz was commissioned to design the vibration isolation for the Dynamic Wafer Stage. The aim was to protect the sensitive laser processing during link trimming from disruptive environmental and floor vibrations. The challenge was to find a solution that meets both the mechanical requirements and cleanroom compatibility while integrating seamlessly into the compact system architecture.
Solution
For the highly efficient vibration isolation of the Dynamic Wafer Stage, Bilz BiAir® membrane air springs ED-AL-E with mechanical level control were used. The air springs ensure a stable working environment in which the sensitive laser processing can run without interference.
Additionally, Bilz precision levelling wedges PKA-AL were installed beneath the machine frame. They provide precise and reproducible positioning of the Dynamic Wafer Stage and contribute to mechanical stability. The wedge mounts enable exact leveling and support uniform load distribution — a key factor for process reliability during highly dynamic scanning movements.
The combination of BiAir® air springs and Bilz precision levelling wedges offers a reliable, low-maintenance, and space-saving solution for vibration isolation in high-precision semiconductor processes.
Highlight
The vibration-isolated storage of highly sensitive and very heavy high-tech equipment is our speciality.
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